other products

M81714/61 Series II Distribution Socket Junction Modules available in a variety of configurations feature the same construction and features as the standard Series II high density modules and are recommended for power distribution applications

Environmentally sealed, multi-contact grounding/bus connection modules are available in sizes AWG26 to AWG16, and are provided with an integral threaded grounding stud.

MIL-T-81714 Series II Electronic Junction Modules meet all dimensional and performance requirements of M81714/62 and are specifically developed for electronic component packaging

High density, low weight, environmentally sealed junction module and light weight composite mounting track system.

Environmentally sealed single wire and dual wire in-line splices to MIL-T-81714 Series I provide a quick, efficient connection qualified to M81714/11 & M81714/12 requirements facilitate system expansion and repair.

M81714/67 Series II high strength lightweight mounting tracks available in black anodized finish as standard.