other products

M81714/61 Series II Distribution Socket Junction Modules available in a variety of configurations feature the same construction and features as the standard Series II high density modules and are recommended for power distribution applications

Pin contact for MIL-T-81714 Series I, contact sizes 12 to 20 accomodates 12 to 26AWG.

Environmentally sealed, multi-contact grounding/bus connection modules are available in sizes AWG22 to AWG12, and are provided with an integral threaded grounding stud.  The stud is electrically and mechanically common to all internal contacts of the module.

MIL-T-81714 Series I Electronic Junction Modules meet all dimensional and performance requirements of M81714/26 and are specifically developed for electronic component packaging.

Environmentally sealed single wire and dual wire in-line splices to MIL-T-81714 Series I provide a quick, efficient connection qualified to M81714/11 & M81714/12 requirements facilitate system expansion and repair. Contacts in sizes AWG22 to AWG16 conform to MIL-C-39029 requirements.

Track-mounted terminal junction modules in five standard sizes AWG12 through AWG26 with a broad selection of bussing variations.